![]() The Ersa EXOS 10/26 convection reflow soldering system has 22 heating chambers, 4 cooling zones and a vacuum chamber after the peak zone, which can be used to reduce the void rate by 99 here before and after condition. Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow. Existing Pyramax customers can easily transfer their process to the new Pyramax Vacuum reflow oven. What is Reflow:- Reflow soldering is a process in which a solder paste is used to create a permanent joint between components to their contact pads.Types o. The stability and reproducibility of the process temperatures ensures high reliability of the formed solder joints. The unit features integrated controls with BTU’s proprietary Wincon™ windows-based control system and full integration with factory MES/Industry 4.0, including vacuum parameters. Vacuum reflow is a process that incorporates thermal profiles with precise control of pressure in the bonding environment. Nitrogen atmosphere capable, the Pyramax Vacuum reflow oven offers a maximum process temperature of 350° C. Vacuum reflow soldering has been shown to have a significant impact on void levels in various applications. The unit is configured with 10 zones of closed-loop convection heating and a maximum production width of 457 x 457mm (18 x 18 inches) inches under vacuum operation. ![]() The Pyramax Vacuum reflow oven has been designed with the requirements of large EMS/high-volume automotive customers in mind. Vacuum reflow oven for high-volume manufacturing
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